Butt joints of 3.0 mm thick sheets of an Al–Li based alloy have been produced using Nd:YAG laser welding without filler metals. The hardness distribution and microstructure of the alloy and welded joints were investigated. The changes in the grain shapes, grain orientations, microtexture, and precipitates of the fusion zone were analyzed using optical microscope, electron back scattered diffraction (EBSD) and transmission electron microscopy (TEM). The results show that Nd:YAG laser welding leads to a change of the microhardness, grain shape, grain orientations, and a disappearance of the microtexture and precipitates. A narrow band of EQZ along the fusion boundary and a predominantly equiaxed dendritic structure are developed in the fusion zone. The formation of the predominately equiaxed dendritic grains is due to a heterogeneous nucleation mechanism aided by equilibrium A13Zr phases as well as the growth of pre-existing nuclei created by dendrite fragmentation, or by grain detachment resulted from Nd:YAG laser welding processes. In addition, Nd:YAG laser welding produces lower Vickers hardness than that of the base metal due to the decrease in the in quantity of δ′ precipitates in the fusion zone.The grain shapes, grain orientations, microtexture, and precipitates of the solidified fusion zone were investigated and compared with the base metal using optical microscope, electron back scattered diffraction (EBSD) and transmission electron microscope (TEM). EBSD orientation map of laser welded joint in 5A90 alloys is presented in Fig. 3. It clearly shows that a narrow band EQZ along the fusion boundary and the predominantly equiaxed grains have been developed in the fusion zone of 5A90 alloys. Also, it is clear that the microstructure of the base metal is characterized by laminated grains with preferred orientations, whereas the fusion zone is predominately equiaxed grains in different colors having random orientations.Highlights► The predominantly equiaxed dendritic structure is developed in the fusion zone. ► The fusion zone with equiaxed grains shows random orientations and microtexture. ► The loss in hardness in the fusion zone is due to the decrease in δ′ precipitates. ► The non-epitaxial growth occurs at fusion boundary. ► The equilibrium A13Zr phases maybe the nuclei of new grains in the fusion zone.

The growth behavior of interfacial intermetallic compounds (IMCs) of SnAgCu/Cu soldered joints was investigated during the reflow process, isothermal aging, and thermal cycling with a focus on the influence of these parameters on growth kinetics. The SnAgCu/Cu soldered joints were isothermally aged at 125°C, 150°C, and 175°C while the thermal cycling was performed within the temperature ranges from −25°C to 125°C and −40°C to 125°C. It was observed that a Cu6Sn5 layer formed, followed by rapid coarsening at the solder/Cu interface during reflowing. The grain size of the interfacial Cu6Sn5 was found to increase with aging time, and the morphology evolved from scallop-like to needle-like to rod-like and finally to particles. The rod-like Ag3Sn phase was formed on the solder side in front of the previously formed Cu6Sn5 layer. However, when subject to an increase of the aging time, the Cu3Sn phase was formed at the interface of the Cu6Sn5 layer and Cu substrate. The IMC growth rate increased with aging temperature for isothermally aged joints. During thermal cycling, the thickness of the IMC layer was found to increase with the number of thermal cycles, although the growth rate was slower than that for isothermal aging. The dwell time at the high-temperature end of the thermal cycles was found to significantly influence the growth rate of the IMCs. The growth of the IMCs, for both isothermal aging and thermal cycling, was found to be Arrhenius with aging temperature, and the corresponding diffusion factor and activation energy were obtained by data fitting. The tensile strength of the soldered joints decreased with increasing aging time. Consequently, the fracture site of the soldered joints migrated from the solder matrix to the interfacial Cu6Sn5 layer. Finally, the shear strength of the joints was found to decrease with both an increase in the number of thermal cycles and a decrease in the dwell temperature at the low end of the thermal cycle.